想找个专业人士帮我用英文翻译一下FPC的生产流程

The following is a BLOCK of FPC production process, simple and weaknesses hope you understand. Thank you very much!
The materials used in FPC
1, raw materials
(1) plastic materials, non-gel material; material on the copper sub-rolled copper and electrolytic copper, rolled copper-free plastic material flexible, folding better.
(2) Material thickness: PI + copper thickness
2, covering film
And plastic covering film formed by the PI.
3, reinforcing
Reinforcement generally have the following; PI reinforcement, PED reinforcement, FR4 reinforcement, steel reinforcement, are generally reinforced the thickness, PI1 / 2 1 / 2, PI11, PI21, PI31 to PI91, PI after The two values represent the PI for the thickness and adhesive thickness, unit Mil. Thickness according to customer request.
4, pure gum
Pure rubber is mainly used for multilayer laminated and layered plates, but also for bonding reinforcement.
5, screen closed membrane
Played a signal role in the main screen closed, but also grounded.
6,3 M glue
Bonding with the reinforced role for the fixed-FPC, etc..

Double-sided FPC production process
(1) is expected to open
The size of the material provisions of the size of the length of the side of the fixed material is 250mm, the other side of the length of the size as the panel's requirements. According to the size of the Panel ruled that the size of the material.
(2) drilling
PTH, positioning holes, the direction of hole
(3) PTH
Through the bath from the oxidation reduction reaction ion plating barrel after activation of the pore walls in preparation for the next step of plating, copper wall thickness of copper reached a certain thickness, so as to achieve the role of conduction .
(4) plating
Improve the coating uniformity of the hole to ensure that the entire page (near the hole and orifice layer) with thickness of certain requirements.
(5) pre-treatment,
Clean sheets, and processing board surface oxides, greasy, etc.
(6) paste dry film,
PE, and PET photosensitive resist composition of the board in the paste dry film to achieve the image transfer function, in the process of etching circuits play a role in protection.
(7) exposure, paste, dry organic polymerization reaction occurs after exposure in the board after the formation of line graphics,
(8) develop
Not been to the dry part of the light will be NACO3 washed, line and some copper will not be washed off the top of the dry film
(9) etching
No dry parts of copper will be etched solution (HCL, H2O2, CUCL) etching away to remove excess copper.
(10)
Check: After etching line width, line spacing, do not have the net open and etching caused by short circuit.
(11)
Cleaning (before treatment): protective film to prepare for the stickers, we must ensure the board clean
(12) affixed protective film
Protective film and the role of PCB's Solser mask is the same, by protecting the membrane of the glue board and paste with PI
(13) Pressing
PI on the glue to the same over a certain temperature and pressure can be pasted together better.
(14) brush plate
Washed of impurities board
(15) Surface Treatment
Immersion Gold surface treatment, electric gold, spray SN, Shen SN, anti-oxidation.
(16) printing character, determined according to customer requirements
(17) ET, check the open circuit, short circuit, to ensure quality
(18) assembly, and some need to supplement the PANEL's strong, and some need to paste a single, determined according to the design of CAM.
(19)
Beer house, put on a single board PANEL punching down through the punch, but also to cut through the laser.
(20) FQC
Quality inspection, the final check out in the production process may produce adverse problems.
(21) for packaging and shipping